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EMAP 2018

The 20th International Conference on Electronic Materials and Packaging

17 - 20 Dec 2018
Hong Kong University of Science and Technology

Welcome to the EMAP 2018!
Register Now

Manuscript Submission Deadline Extended: 23 November 2018


Firm Visit to ASM Pacific Technology Hong Kong is on a
First-Come Fisrt-Served Basis
Please send an email to emap2018@ust.hk to reserve your seat.

The 20th International Conference on Electronics Materials and Packaging (EMAP 2018) will be held in Hong Kong, a gateway in between the East and West. The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. The EMAP 2018 Committee is now inviting researchers, engineers, scientists and professors and students to submit an abstract and join EMAP 2018. Accepted papers will be submitted for inclusion into IEEE Xplore® Digital Library.
With a rich, successful history of previous EMAP conferences held in Japan, Korea, Malaysia, Singapore, and Taiwan, this annual event offers a great opportunity to unite people from academia, research institutions and industries to share their innovative thoughts, state-of-the-art technologies and recent developments. The program includes invited and keynote presentations from world-renowned speakers, interactive sharing sessions, and technical short courses. An excursion will also be arranged after the technical sessions to introduce the natural side of Hong Kong. Come and join us!

2 Short Courses

MicroLED - Fabrication and application
by Prof. Hao-chung Kuo (National Chaio-Tung University)
Fan-Out Wafer/Panel-Level Packaging for 3D IC Heterogeneous Integration
by Dr. John H. Lau (ASM)

8 Keynotes

10 Invited Talks

More than 60 Presentations

Topics:

• Additive Manufacturing

• Advanced Packaging Technologies

• Emerging Technologies

• Design, Modeling and Simulation

• High Density and 3D Packaging

• Interconnections

• Materials and Processing


• Microsystems Packaging and Applications

• Optoelectronics and Photonics

• Power Electronics Integration

• Quality and Reliability Assessment

• System Integration

• Thermal Management

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